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                • 晶圓級封裝

                • 系統級封裝

                • 倒裝

                • 基板封裝

                • 引線框封裝

                • 分立器件

                Fan-in (Wafer Level Package)

                • WLCSP

                • eWLCSP

                Fan-out (Wafer Level Package)

                • eWLB 300mm / HD 330mm (2D, 2.5D, 3D)

                Integrated Passive Devices

                • IPD

                Through Silicon Via

                • TSV for CIS

                • TSV for rocessor (in development)

                System-in-Package

                • FOWLP SiP

                • Laminate FC SiP

                • Laminate FC + WB SiP

                • SiP Modules

                • Leadframe WB SiP

                • Laminate Stack Die WB SiP

                Flip Chip Packages

                • fcFBGA

                • fcBGA

                • fcCuBE

                • Bare die fcPoP

                • Molded Laser fcPoP

                • Flip Chip on Leadframe (FCOL)

                • Molded Interconnect System (MIS)

                Substrate Packages

                • PBGA

                • FBGA (Stacked Die)

                • Package-on-Package

                • MEMS

                • LGA

                • Smart Card

                Lead Frame Packages

                • QFN

                • DFN

                • QFP

                • SOT

                • SOP

                • DIP

                • Molded Interconnect System (MIS)

                Discrete Packages

                • TO

                • SOD

                • SOT

                • FBP

                • DFN

                • SOP

                Discrete Products

                • Diodes

                • MOSFET

                • Transistors

                • Rectifier

                • BRT

                • TRIACS

                • TVS

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